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Informatique
HDI-High Density Interconnect |
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Number of layers |
4L-28L |
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HDI Ability |
5+N+5 |
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Special Materials |
Hig TG & Hig Speed&Hig Frequency Materials: ISOLAR,Rogers,TACONIC,Panasonic. |
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PCB thickness |
0.38mm-3mm |
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Minimum track width/Space |
0.075mm/0.075mm |
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Cu thickness (finished) |
1/2oz to 3oz |
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Maximum Panel size |
610mmX450mm |
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Surface treatment |
HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Hard Gold/Soft Gold, Gold Finger,ENEPIG. |
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Minimum Drill size(Laser) |
0.075mm |
Bonne affaire : acheter au vendeur
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Cette page concerne les importateurs et exportateurs de HDI-High Density Interconnect Rechercher dans la catégorie : Informatique Rechercher dans la catégorie : high, density, interconnect |
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