Wafer Back Grinding Wheel
Détails
Chine (Rép. pop) Habillement Femme
Habillement Femme

Wafer Back Grinding Wheel

E-Grind Back-Grinding wheels have developed the technology to combine diamond and bond to meet your requirements. Especially our advanced porosity technology makes it possible to grind all types of wafers with less bug-surface damage. E-Grind Wafer Back Grinding Wheel use a special vitrified bond for rough grinding or a resin

bond for fine finishing and improved process accuracy. Our wafer grinding wheel features free cutting, excellent wear resistance, and good shape maintainability for long durability.
Performance of Wafer Back Grinding Wheel
Leading technology
Good self-sharpening
No dressing required
High yeild rate of work-piece
Applications of Wafer Back Grinding Wheel
E-Grind wafer back grinding wheel serves various crucial applications in the LED and Semiconductor industries, primarily focusing on the back thinning process of wafers. The use of wafer back grinding wheel contributes to the production of high-performance semiconductor devices, microelectronics, and LED components, while also improving yield and cost efficiency in the manufacturing process.
Semiconductor Device Manufacturing:
Wafer back grinding wheels are extensively employed in the semiconductor industry for the manufacturing of integrated circuits (ICs) and other semiconductor devices. These wheels play a vital role in the thinning of semiconductor wafers, a critical step in the production of high-performance electronic components.
LED (Light-Emitting Diode) Production:
In the LED industry, wafer back grinding wheels are utilized for back thinning processes during the production of LED wafers. This is essential for achieving the desired thickness of the wafer while maintaining precision, as it impacts the optical and electrical properties of the final LED devices.
Microelectronics Manufacturing:
The precision and efficiency of wafer back grinding wheels make them indispensable in the production of microelectronic components. These components are integral to various electronic devices, including smartphones, tablets, and other consumer electronics.

E grind, as an excellent cbn grinding wheel suppliers, offers a wide range of metal bonded diamond grinding wheels for you to choose from.

Localisation : Room 1841, Tower A, Wanda Plaza, 171#, Zhongyuan Road, Zhengzhou City, Henan Province, China, 450000 zhengzhou,
Personne à contacter : wheel egrind, 0371 68616868

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Wafer Back Grinding Wheel

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grinding, wafer, wheel, back
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