TAIYO - 103 Annonces

Mercredi 31 mai 2023

Prix : 100USD

Number of layers: 4 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 6/3.5mil Inner layer W/S: 6/4mil Thickness: 0.8mm Min. hole diameter: 0.28mm Special process: impedance control+half hole Advantages Of 4 Layer ENIG Impedance Control Half Hole Fr4 PCB Own lamination process...

Mercredi 31 mai 2023

Prix : 100USD

Number of layers: 2 Surface finish: OSP Base material: FR4 Outer Layer W/S: 6/4mil Thickness: 1.0mm Min. hole diameter: 0.25mm Special process: impedance control+half hole Advantages Of 2 Layer OSP Impedance Control Half Hole PCB Own lamination process to convenient production for...

Mercredi 31 mai 2023

Prix : 100USD

Number of layers: 2 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 7/4mil Thickness: 1.0mm Min. hole diameter: 0.3mm Special process: impedance control+half hole Advantages Of 2 Layer ENIG Impedance Control Half Hole PCB Product Own lamination process to convenient production...

Mercredi 31 mai 2023

Prix : 100USD

Number of layers: 2 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 8.5/3.5mil Thickness: 0.8mm Min. hole diameter: 0.2mm Special process: half hole Advantages Of Two Sided PCB Own lamination process to convenient production for Multilayer PCB and shorten the lead time. Jiangxi...

Samedi 29 avril 2023

Quantité : 0 PCS-1000 - Prix : 1 USD/set ~ 300 USD/

PCB Capability GreensTone has successfully served customers with PCB manufacturing service in communication, industial devices, new engrgy, power supply, sensors, smart home applications control, smart industial control , medical devices and security control device and so on. GreensTone...

Mardi 11 avril 2023

Number of layers: 4 Surface finish: ENIG Base material: High TG FR4 Outer Layer W/S: 4/3.5mil Inner layer W/S: 4/3.5mil Thickness: 1.0mm Min. hole diameter: 0.25mm Special process: Impedance Control Advantages Of 4 Layer High TG Impedance Control Fine Pitch PCB Own lamination process...

Mardi 11 avril 2023

Number of layers: 4 size：80*88mm Surface finish: ENIG Base material: Rogers FR4 4350B Min. hole diameter: 0.3mm Minimum Line Width：0.230mm Minimum Line Space：0.170mm Thickness: 1.0mm Advantages Of 4 Layer Rogers FR4 PCB Own lamination process to convenient production for Multilayer...

Mardi 11 avril 2023

Number of layers: 2 Surface finish: ENIG Base material: Taconic TLY-5A Min. hole diameter: 0.3mm Outer Layer W: 1.046mil Outer layer S: /mil Thickness: 0.94mm Advantages Of 2 Layer Taconic PCB Own lamination process to convenient production for Multilayer pcb product and shorten the lead time...

Mardi 11 avril 2023

Number of layers: 2 size: 184.2*158.9mm Surface finish: LF-HASL Base material: Rogers 4350B Min. hole diameter: 0.4mm Minimum Line Width: 0.227mm Minimum Line Space: 0.127mm Thickness: 0.7mm Advantages Of 2 Layer Rogers LF-HASL PCB Own lamination process to convenient production for...

Mardi 11 avril 2023

Number of layers: 2 size: 96.45*87.73mm Surface finish: ENIG Base material: Rogers 4350B Min. hole diameter: 0.5mm Minimum Line Width：/mm Minimum Line Space：0.139mm Thickness: 0.35mm Advantages Of 2 Layer Rogers ENIG RF Circuit Board Own lamination process to convenient production...

Mardi 11 avril 2023

Number of layers: 2 size: 98.45*49.45mm Surface finish: ENIG Base material: Rogers 4350B Min. hole diameter: 0.5mm Minimum Line Width：/mm Minimum Line Space：0.139mm Thickness: 0.35mm Advantages Of 2 Layer Rogers PCB Own lamination process to convenient production for Multilayer PCB...

Mardi 11 avril 2023

Number of layers: 2 Surface finish: ENIG Base material: F4B Min. hole diameter: 0.8mm Outer Layer W: 6mil Outer layer S: 6mil Thickness: 1.0mm Advantages Of 2 Layer F4B PCB Own lamination process to convenient production for Multilayer PCB and shorten the lead time. Jiangxi facility...

Mercredi 08 février 2023

Number of layers: 6 Surface finish: HASL Base material: FR4 Outer Layer W/S: 9/4mil Inner layer W/S: 11/7mil Thickness: 1.6mm Min. hole diameter: 0.3mm Special process: Blind Vias Advantages Of 6 Layer HASL Blind Buried Via PCB Own lamination process to convenient production for...

Mercredi 08 février 2023

Number of layers: 14 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/5mil Inner layer W/S: 4/3.5mil Thickness: 1.6mm Min. hole diameter: 0.2mm Special process: Blind & Buried Vias Advantages Of 14 Layer PCB Own lamination process to convenient production for Multilayer...

Mercredi 08 février 2023

Number of layers: 12 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 7/4mil Inner layer W/S: 5/4mil Thickness: 1.5mm Min. hole diameter: 0.25mm Special process: Blind Vias Advantages Of 12 Layer PCB Own lamination process to convenient production for Multilayer PCB and shorten...

Mercredi 08 février 2023

Number of layers: 10 Surface finish: ENIG Base material: FR4 W/S: 4/4mil Thickness: 1.6mm Min. hole diameter: 0.2mm Special process: Blind Vias Advantages Of 10 Layer ENIG Blind Vias PCB Own lamination process to convenient production for Multilayer PCB and shorten the lead time....

Mardi 13 décembre 2022

Prix : 100USD

Fast PCB Prototyping Service 97% On-Time Delivery Ratio In accordance with IPC standards, high quality PCB prototype manufacturer strictly control the qualified rate of finished products. Prototype PCB board manufacturer implement PDCA process to continuously improve quality and...

Mardi 13 décembre 2022

Prix : 100USD

Number of layers: 8 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/3mil Inner layer W/S: 4/3mil Thickness: 1.2mm Min. hole diameter: 0.2mm Special process: impedance control Advantages Of 8 Layer ENIG Impedance Control PCB Own lamination process to convenient production...

Vendredi 21 octobre 2022

Prix : 10-30USD

Number of layers: 4 Surface finish: ENIG Base material: High TG FR4 Outer Layer W/S: 4/3.5mil Inner layer W/S: 4/3.5mil Thickness: 1.0mm Min. hole diameter: 0.25mm Special process: Impedance Control Advantages Of 4 Layer High TG Impedance Control Fine Pitch PCB Own lamination process...

Vendredi 21 octobre 2022

Prix : 10-30USD

Number of layers: rogers fr4 size：80*88mm Surface finish: ENIG Base material: FR4+Rogers 4350B Min. hole diameter: 0.3mm Minimum Line Width：0.230mm Minimum Line Space：0.170mm Thickness: 1.0mm Advantages Of 4 Layer rogers fr4 pcb Own lamination process to convenient production for...

Vendredi 21 octobre 2022

Prix : 10-30USD

Number of layers: 2 Surface finish: ENIG Base material: Taconic TLY-5A Min. hole diameter: 0.3mm Outer Layer W: 1.046mil Outer layer S: /mil Thickness: 0.94mm Advantages Of 2 Layer Taconic PCB Own lamination process to convenient production for Multilayer PCB and shorten the lead time...

Vendredi 21 octobre 2022

Prix : 10-30USD

Number of layers: 2 size: 184.2*158.9mm Surface finish: LF-HASL Base material: Rogers 4350B Min. hole diameter: 0.4mm Minimum Line Width: 0.227mm Minimum Line Space: 0.127mm Thickness: 0.7mm Advantages Of 2 Layer Rogers LF-HASL PCB Own lamination process to convenient production for...

Vendredi 21 octobre 2022

Prix : 10-30USD

Number of layers: 2 size: 96.45*87.73mm Surface finish: ENIG Base material: Rogers 4350B Min. hole diameter: 0.5mm Minimum Line Width：/mm Minimum Line Space：0.139mm Thickness: 0.35mm Advantages Of 2 Layer Rogers ENIG Rf PCB Own lamination process to convenient production for Multilayer...

Vendredi 21 octobre 2022

Prix : 10-30USD

Number of layers: 2 size: 98.45*49.45mm Surface finish: ENIG Base material: Rogers 4350B Min. hole diameter: 0.5mm Minimum Line Width：/mm Minimum Line Space：0.139mm Thickness: 0.35mm Advantages Of 2 Layer Rogers PCB Own lamination process to convenient production for Multilayer PCB...

Vendredi 21 octobre 2022

Prix : 10-30USD

Number of layers: 2 Surface finish: ENIG Base material: F4B Min. hole diameter: 0.8mm Outer Layer W: 6mil Outer layer S: 6mil Thickness: 1.0mm Advantages Of 2 Layer F4B PCB Own lamination process to convenient production for Multilayer PCB and shorten the lead time. Jiangxi facility...

Vendredi 02 septembre 2022

Number of layers: 16 Surface finish: ENIG Base material: FR4 Thickness: 3.0mm Min. hole diameter: 0.35mm size：420×560mm Outer Layer W/S: 4/3mil Inner layer W/S: 5/4mil Aspect Ratio: 9: 1 Special process: via-in-pad Impedance Control Press Fit Hole Advantages Of 16 Layer ENIG Press...

Vendredi 02 septembre 2022

Number of layers: 10 Surface finish: ENIG Aspect Ratio: 8: 1 Base material: FR4 Outer Layer W/S: 4/4mil Inner layer W/S: 5/3.5mil Thickness: 2.0mm Min. hole diameter: 0.25mm Special process: Impedance Control, Resin Plugging, Different Copper Thickness Advantages Of 10 Layer Impedance...

Samedi 02 juillet 2022

97% On-Time Delivery Ratio In accordance with IPC standards, high quality pcb prototype manufacturer strictly control the qualified rate of finished products. Prototype pcb board manufacturer implement PDCA process to continuously improve quality and prototype board pcb custom order performance...

Samedi 02 juillet 2022

Number of layers: 8 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/3mil Inner layer W/S: 4/3mil Thickness: 1.2mm Min. hole diameter: 0.2mm Special process: impedance control Advantages Of 8 Layer PCB ENIG Impedance Control PCB Own lamination process to convenient production...

Mardi 17 mai 2022

Number of layers: 8 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/3.5mil Inner layer W/S: 4/3.5mil Thickness: 1.2mm Min. hole diameter: 0.2mm Special process: impedance control+half hole Advantages Of 8 Layer ENIG Impedance Control Half Hole PCB Own lamination process...