Vitrine de HHCIRCUITS Xinfeng Huihe Circuits Co., Ltd.

Wednesday 31 May 2023

Prix : 100USD

Heavy Copper PCB, pcb fabrication up to 12oz, large current, pcb fabrication base material is FR4/Teflon/Ceramic, pcb fabrication used in high-power power supply and motor circuits products. HUIHE CIRCUITS is one of the heavy copper PCB manufacturers, we have passed ISO9001/ISO13485/IATF16949/UL/...

Wednesday 31 May 2023

Prix : 100USD

Number of layers: 8 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/3mil Inner layer W/S: 5/4mil Thickness: 1.6mm Min. hole diameter: 0.2mm Special process: half hole Advantages Of 8 Layer ENIG Half Hole Custom Made PCB Own lamination process to convenient production for...

Wednesday 31 May 2023

Prix : 100USD

Number of layers: 4 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 6/4mil Inner layer W: 21mil Thickness: 0.4mm Min. hole diameter: 0.2mm Special process: impedance control+half hole Advantages Of 4 Layer ENIG Impedance Control Half Hole PCB Electric Circuit Board Own lamination...

Wednesday 31 May 2023

Prix : 100USD

Number of layers: 4 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 6/3.5mil Inner layer W/S: 6/4mil Thickness: 0.8mm Min. hole diameter: 0.28mm Special process: impedance control+half hole Advantages Of 4 Layer ENIG Impedance Control Half Hole Fr4 PCB Own lamination process...

Wednesday 31 May 2023

Prix : 100USD

Number of layers: 2 Surface finish: OSP Base material: FR4 Outer Layer W/S: 6/4mil Thickness: 1.0mm Min. hole diameter: 0.25mm Special process: impedance control+half hole Advantages Of 2 Layer OSP Impedance Control Half Hole PCB Own lamination process to convenient production for...

Wednesday 31 May 2023

Prix : 100USD

Number of layers: 2 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 7/4mil Thickness: 1.0mm Min. hole diameter: 0.3mm Special process: impedance control+half hole Advantages Of 2 Layer ENIG Impedance Control Half Hole PCB Product Own lamination process to convenient production...