COIN612/R
WLP+ASIC Uncooled thermal camera module
COIN series uncooled thermal imaging camera core integrates the wafer-level package detector produced by GST, ASIC chip for imaging processing, micro-motion electromagnetic threshold shutter and general optical interface. It is beneficial to OEM customers for secondary development and suitable for the development and integration of thermal imager in various applications.
640x512IR resolution
12μmPixel Pitch
<3s Start-up Time
<40mKNETD
COIN612 integrates 640x512@12μm wafer level package (WLP) infrared thermal detector, high performance signal processing circuit and image processing algorithm.
The COIN612 infrared thermal camera core features in sharp and crisp image presentation, compact size and low cost. It also has an optional thermographic function with measurement range from -20℃~550 ℃ for industrial temperature measurement.
Its lightweight and flexible features with various industry standard interfaces make it beneficial to OEM customers for secondary development and integration in all kinds of infrared thermal cameras.
Until now, we have provided our customers with various mature and stable infrared thermal imaging solutions. It's easier for COIN series to be integrated into more terminal products and greatly reduces the cost for customers.
Technical Parameters
Model
COIN612/R
ADD TO COMPARE
IR Detector Performance |
|
Resolution |
640X512@12μm |
Spectral response |
8~14μm |
NETD |
<40mk |
Image Processing |
|
Frame rate |
9Hz/25Hz/30Hz/50Hz/60Hz |
Start-up time |
<3秒 |
Analog video |
PAL/NTSC |
Digital video |
Y16/YUV/BT656 |
Dimming |
Linear/Histogram/Mixed three modes |
Digital zoom |
1~8X continual zoom,step size 1/8 |
Image display |
Black hot/White hot/Pseudo color |
Image direction |
Horizontally/Vertically/Diagonally Flip |
Image algorithm |
NUC,AGC,IDE,DNR |
Image Display Performance |
|
Communication mode |
RS232-TTL, 115200bps |
Supply voltage |
3.5~5.5V |
Typical power consumpti |
<0.75W</span> |
External Cable Connection |
|
Standard external interface |
50pin_HRS interface |
Operating temperature range |
-10℃~50℃ |
Temperature range |
-20℃~150℃,100℃~550℃ |
Temperature accuracy |
±3℃ or ±3% |
Sdk |
ARM/Windows SDK,full screen thermograph |
Physical Characteristic |
|
Dimension(mm) |
25.4x25.4x14.1(Including shutter) |
Weight |
机芯:13g±0.5g(Including shutter) |
Operation temperature |
-40°C~+70°C |
Storage temperature |
-45°C~+85°C |
Humidity |
5%~95%,non-condensing |
Vibration |
Random Vibration 5.35grms,3 axis |
Shock |
Half-sine wave,40g/11ms,3 axis 6 directi |
Optics |
|
Optional lens |
Fixed focus athermal:8.8mm/13mm/19mm |
* All specifications are subject to the actual product. Guide sensmart reserves the right to change the technical specifications without notice or liability to you.
For more information about guide infrared china, please feel free to contact us!
Personne à contacter : .com GuideSensmart, 86 27 8129 8784
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