Vitrine de HHCIRCUITS Xinfeng Huihe Circuits Co., Ltd.

Tuesday 11 April 2023

Number of layers: 2 size: 184.2*158.9mm Surface finish: LF-HASL Base material: Rogers 4350B Min. hole diameter: 0.4mm Minimum Line Width: 0.227mm Minimum Line Space: 0.127mm Thickness: 0.7mm Advantages Of 2 Layer Rogers LF-HASL PCB Own lamination process to convenient production for...

Tuesday 11 April 2023

Number of layers: 2 size: 96.45*87.73mm Surface finish: ENIG Base material: Rogers 4350B Min. hole diameter: 0.5mm Minimum Line Width：/mm Minimum Line Space：0.139mm Thickness: 0.35mm Advantages Of 2 Layer Rogers ENIG RF Circuit Board Own lamination process to convenient production...

Tuesday 11 April 2023

Number of layers: 2 size: 98.45*49.45mm Surface finish: ENIG Base material: Rogers 4350B Min. hole diameter: 0.5mm Minimum Line Width：/mm Minimum Line Space：0.139mm Thickness: 0.35mm Advantages Of 2 Layer Rogers PCB Own lamination process to convenient production for Multilayer PCB...

Tuesday 11 April 2023

Number of layers: 2 Surface finish: ENIG Base material: F4B Min. hole diameter: 0.8mm Outer Layer W: 6mil Outer layer S: 6mil Thickness: 1.0mm Advantages Of 2 Layer F4B PCB Own lamination process to convenient production for Multilayer PCB and shorten the lead time. Jiangxi facility...

Wednesday 08 February 2023

Number of layers: 6 Surface finish: HASL Base material: FR4 Outer Layer W/S: 9/4mil Inner layer W/S: 11/7mil Thickness: 1.6mm Min. hole diameter: 0.3mm Special process: Blind Vias Advantages Of 6 Layer HASL Blind Buried Via PCB Own lamination process to convenient production for...

Wednesday 08 February 2023

Number of layers: 14 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/5mil Inner layer W/S: 4/3.5mil Thickness: 1.6mm Min. hole diameter: 0.2mm Special process: Blind & Buried Vias Advantages Of 14 Layer PCB Own lamination process to convenient production for Multilayer...